Unless you work with alloys and thin film development on a regular basis, the process of Indium bonding, and perhaps even an understanding of Indium itself, is probably not something of focus.
This is a technique that is used with sputtering target bonding applications to enhance the actual bonding of the material to the base component. Without the use of Indium bonding, it is possible for there to be areas where there can be irregularities with the bonding process.
Additionally, by using Indium, not only is the adhesive ability vastly improved in a uniform manner across the surface, but there is also better and more even thermal conductivity. This is a property that will be of essential consideration for many components in a wide variety of industrial applications.
Benefits of Indium
Indium itself is a very soft, naturally occurring metal that is about as abundant as cadmium, which makes it limited for use in large-scale commercial applications. It is also not readily available as an isolated metal. However, it can be obtained through the production of zinc and lead as well as in limited amounts in the processing of copper.
It has been used in many different applications for stabilizing non-ferrous metals. It was originally used to coat bearing and in aircraft engines. Now it is most commonly found in thin film applications on glass, semiconductors and on gaskets.
With the use of Indium bonding issues with the high toxicity of mercury, which has similar properties, can be avoided. It also has a low melting point that makes it particularly good for sputtering target bonding.
There are important parameters to using Indium the process of sputtering target bonding. Be sure to work with an experienced company that has the ability to control the temperature during the process for exceptional results.
The experts at ACI Alloys, Inc. can provide Indium bonding services to meet your specifications and desired end results. To learn more see us online at Website.